板式透明導(dǎo)電薄膜沉積設(shè)備(RPD/PAR/PVD)

設(shè)備名稱 Equipment Name

板式透明導(dǎo)電薄膜沉積設(shè)備(RPD/PAR/PVD)  Inline TCO Coating Equipment (Reactive Plasma Deposition, RPD/PAR),and Magnetron Sputter,PVD

設(shè)備型號 Equipment Model

PAR5500A

設(shè)備用途 Equipment Application

板式物理鍍膜設(shè)備用于鍍著透明導(dǎo)電薄膜于襯底(硅片、玻璃片、柔性基板)。

In-line physical coating equipment for Transparent Conductive Oxide (TCO) coating on wafer,glass plate or flexible substrate.

鍍膜原理 Coating Principle

1、磁控濺射沉積。

Magnetron Sputter (PVD).

2、反應(yīng)式等離子體沉積。

Reactive Plasma Deposition (RPD).

技術(shù)特點(diǎn)  Features

1、PVD具有多階陰極，可以制備種子層與多種折射率的疊層TCO。

Multiple cathode operation for seed layer and multiple refractive index tandem TCO.

2、RPD具有無高能離子轟擊襯底特點(diǎn)，能制備高少子遷移率的TCO。
No bombardment on the substrate while keeping high mobility.

設(shè)備參數(shù)  Parameters