Horizontal PEALD (A&P)

  Features  

· Atomic layer deposition process, with better film uniformity.

· Multi-layer thin film deposited in the same process equipment or same furnace tube, reducing process steps and wafer breakage rate, improving yield effectively.

· Independent R&D of liquid source precursor vapor delivery and precursor rapid switching technology.

· Suitable for deposition of passivation layer for different precursors and materials, with a large space for process expansion.