Features
· Throughput: 400pcs/batch, 9600pcs/h(210mm wafer),480pcs/batch, 12000pcs/h (182mm wafer).
· Various additive technologies available.
· Wafer thickness down to 120μm.
· With dry clean area and self-cleaning system.
· Quick inline bath change.
· Available with MES, RFID system, inline weight testing optional.