Automatic Wafer Handling System for DOA Equipment

  Features  

· Six axis robot from world leading brand to load/unload wafers to ensure high reliability of wafer pick & place,and reduce the breakage rate and scratches on wafers.

· HMI adopts industrial computer (IPC) to run software and realize high-speed data interaction through network communication.

· Special processing technology is adopted for important parts such as combs and grippers which greatly reduce comb marks and gripper marks, and the comb and gripper can be replaced quickly.  

· MES function/ sheet resistance detection module/ AGV system are optional; automation can be 1-by-2,functions can be customized according to customer needs.