Batch-type Alkaline Polishing Equipment

  Features  

· Throughput: 400pcs/batch,9600pcs/h(210 wafer),480pcs/batch,12000pcs/h(182 wafer).

· Compatible with rear side etch polishing and mono-crystalline rear side texturing process.

· Suitable for various additives.

· Wafer thickness handling capability up to 120μm.

· With dry clean area and self-cleaning system.

· Quick inline bath change.

· Suitable with MES, RFID system, inline weight testing optional.