The wet process equipment for integrated circuits independently developed and manufactured by Tronway Changzhou has been successfully delivered to customers

As a leading enterprise of solar cell manufacturing equipment, in order to realize the optimization of industrial structure, improve the company’s independent innovation ability and R&D level in related fields and follow the product development path to the semiconductor equipment field, S.C’s wholly –owned subsidiary Changzhou S.C Exact Equipment Co., Ltd established a semiconductor wet process research laboratory in 2019, gathering international team to focus on the research and development of IC wet process equipment. With the strengthening of national support for IC in recent years, strong market demand and the promotion of product development, Changzhou S.C Exact Equipment Co., Ltd invested the establishment of Tronway Changzhou Co., Ltd in September, 2020, specializing in the IC wet process equipment research and development, manufacturing and sales, mainly includes batch typr and mono wafer wet cleaning equipment.    

Up to now, the company has get bulk orders for batch wet cleaning equipment from important customers and successfully delivered 3 sets of IC batch wet cleaning equipment to customer for mass production on July 21, 2021. The equipment under design and manufacture also include batch cleaning equipment and related auxiliary equipment for MicroLED, third-generation compound semiconductor and IC IDM fabs, covering nearly 70% of wet process steps for IC below 200mm, including photoresist removal, oxidation film etching, metal film etching, pre-furnace cleaning and organic solvent cleaning etc., with cassette and cassette-less two types, covering wafer size from 100mm to 200mm.

The successful delivery of the first batch of semiconductor wet cleaning equipment has realized the company’s expansion from photovoltaic equipment design and manufacturing to the pan-semiconductor and semiconductor industry and surpassing on the strategic route again, and will also become the new main force for localization of national IC equipment.